Kingston 32GB 3200MHz DDR4 ECC Reg CL22 DIMM 2Rx4 Hynix D Rambus No Produit:KSM32RD4/32HDR
Fabricant:
KINGSTON TECHNOLOGY
Numéro de produit:KSM32RD4/32HDR
32GB 3200MHz DDR4 ECC Reg CL22 DIMM 2Rx4 Hynix D Rambus
32GB 3200MHz DDR4 ECC Reg CL22 DIMM 2Rx4 Hynix D Rambus
DESCRIPTION
Kingston's KSM32RD4/32HDR is a 4G x 72-bit (32GB)
DDR4-3200 CL22 SDRAM (Synchronous DRAM) registered w/
parity, 2Rx4, ECC, memory module, based on thirty-six 2G x
4-bit FBGA components. The SPD is programmed to JEDEC
standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each
288-pin DIMM uses gold contact fingers. The electrical and
mechanical specifications are as follows:
FEATURES
• Power Supply: VDD = 1.2V
• VDDQ = 1.2V
• VPP = 2.5V
• VDDSPD = 2.41V to 2.75V
• Functionality and operations comply with the DDR4 SDRAM datasheet
• 16 internal banks
• Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for
the banks in the same or different bank group accesses are available
• Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Supports ECC error correction and detection
• On-Die Termination (ODT)
• Temperature sensor with integrated SPD
• This product is in compliance with the RoHS directive.
• Per DRAM Addressability is supported
• Internal Vref DQ level generation is available
• Write CRC is supported at all speed grades
• CA parity (Command/Address Parity) mode is supported
DESCRIPTION
Kingston's KSM32RD4/32HDR is a 4G x 72-bit (32GB)
DDR4-3200 CL22 SDRAM (Synchronous DRAM) registered w/
parity, 2Rx4, ECC, memory module, based on thirty-six 2G x
4-bit FBGA components. The SPD is programmed to JEDEC
standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each
288-pin DIMM uses gold contact fingers. The electrical and
mechanical specifications are as follows:
FEATURES
• Power Supply: VDD = 1.2V
• VDDQ = 1.2V
• VPP = 2.5V
• VDDSPD = 2.41V to 2.75V
• Functionality and operations comply with the DDR4 SDRAM datasheet
• 16 internal banks
• Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for
the banks in the same or different bank group accesses are available
• Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Supports ECC error correction and detection
• On-Die Termination (ODT)
• Temperature sensor with integrated SPD
• This product is in compliance with the RoHS directive.
• Per DRAM Addressability is supported
• Internal Vref DQ level generation is available
• Write CRC is supported at all speed grades
• CA parity (Command/Address Parity) mode is supported
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